Screen replacement components before approving an alternative BOM
Use this engineering assistant to classify replacement risk for power switches, isolated gate drivers, and current sensing parts. It turns component assumptions into must-check parameters, required datasheet curves, calculations, lab tests, and BOM context for manual review.
Component Advisor
Screen component replacements before BOM review
Select a component category and operating assumptions. The advisor classifies replacement risk, required checks, datasheet curves, calculations, lab tests, and BOM fields.
Top class: Tuning required
This is a first-pass engineering screening aid. It does not replace datasheet review, simulation, thermal testing, safety assessment, or certification testing.
Replacement screening results
Sorted by accumulated rule score and engineering severity.
3 focus areas
Switching Behavior
Score: 3
Tuning required
SiCEMI riskDriver sensitive
Why:
SiC alternatives can change dv/dt, gate charge, threshold, short-circuit behavior, and EMI margin even when voltage and current ratings look similar.
Action:
Review gate resistor, driver voltage, CMTI, Miller clamp, short-circuit protection, switching loss, and conducted/radiated EMI margin.
Must check
Vds rating
Rds(on)
Qg
Vgs(th)
package
thermal resistance
Datasheet curves
Rds(on) vs temperature
switching energy
SOA
transient thermal impedance
Calculations
Lab tests
double-pulse test
thermal rise
EMI scan
short-circuit behavior if required
BOM fields
original switch
candidate switch
gate driver
gate resistor
bus voltage
switching frequency
Matched rules
SiC fast-switching review
Voltage And Safety Margin
Score: 3
Certification-impacting
High voltageSafety marginManual review required
Why:
High bus voltage tightens voltage derating, creepage, clearance, isolation, and avalanche or short-circuit assumptions.
Action:
Confirm voltage derating, package creepage/clearance, surge conditions, snubber stress, and safety/certification constraints.
Must check
voltage rating
derating
creepage
clearance
package insulation
Datasheet curves
SOA
avalanche rating
thermal impedance
Calculations
Lab tests
high-line operation
surge stress
thermal chamber
BOM fields
bus voltage
surge target
snubber values
target market
Matched rules
High bus voltage margin
Drop-In Risk
Score: 2
Tuning required
Pin-to-pin riskyThermalEMI
Why:
Pin-compatible power switches can still change gate charge, switching speed, thermal impedance, body diode behavior, and EMI.
Action:
Do not approve as drop-in until gate waveform, temperature, efficiency, and fault behavior are checked.